來源： 發布時間：2016-4-15 16:21:48 瀏覽次數：0次
HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.
Package Design Team services include:
? Customer-centric design.
? DFM (Design For Manufacturing) and DFC (Design for Cost).
? Supporting auto- check of design and Drawings.
Flip Chip Package